An expert who has achieved level 3 by getting 1000 points
An expert who has finished #1 on the weekly Top 10 Fixya Experts Leaderboard.
An expert that got 20 achievements.
An expert that got 10 achievements.
Computers & ... Master
Re: How to set temperature and time on a bga rework...
It depends on the type of solder being used, different temperatures for different metals. Keep pre heat temperature to 10degrees below melting point of the solder used and the BGA will lift off with the correct heat on it without reworking the whole board.
- If you need clarification, ask it in the comment box above.
- Better answers use proper spelling and grammar.
- Provide details, support with references or personal experience.
Tell us some more! Your answer needs to include more details to help people.You can't post answers that contain an email address.Please enter a valid email address.The email address entered is already associated to an account.Login to postPlease use English characters only.
Tip: The max point reward for answering a question is 15.
To choose the right BGA rework station, you need to know complete details about it. BGA rework is an important part of the procedures at electronic assembly and repair houses across the world. An enormously challenging procedure, the BGA rework involves high skill levels, as well as a touch of creativity displayed by the technician executing it.
The equipment with which an electronics assembly and repair technician conducts the BGA repair is called a BGA work station.
Actual rework involved in the BGA rework station is basically conducted following the assembly of electronic printed circuit boards or PCB. PCB assembly involves a long procedure of detail oriented and careful work execution involving steps such as soldering and desoldering of joints to assemble the perfect PCB. See more http://www.sumitron.com/products/automatic-soldering-for-pcba/bga-rework-station
Hello. Tell me, please, could you send me the exact settings for Bga Rework Station W-KIDI KID R600. The machine is, the guide and the drive is lost. If possible, please send, settings. Thank you in advance. I will be very grateful for the help.Please help solve the problem of professional settings
The bottom of the Processor (CPU) has 478 contact pins. The processor socket has 478 matching socket holes.
With a BGA surface mount there are no contact pins, on the chipset; nor are there matching socket holes on the motherboard.
Instead there are Solder Balls on the bottom of the chipset, and matching Copper Pads on the motherboard. (The pads are also gold plated)
The chipset is set down on the motherboard, with the Solder Balls lining up on the matching Copper Pads; on the motherboard. Then Heat is applied at a SPECIFIC temperature, and LENGTH of time. Remember this..........
When the chipset is heated properly, the Solder Balls melt. The solder connections made are now called Solder Joints. With constant overheating of the chipset, the solder joints made now start to partially melt.
As the chipset cools down, (Laptop is shut off), the solder joints re-solidfy. This cause Cold Solder joints, and a poor contact of chipset TO motherboard.
You can TRY to reflow the chipset, but my advice would be to replace it. I believe that one has had it. This IS an advertisement, but solely being used so you can see how to search on your own,
Not something I subscribe to, as it is not known as a long lasting method, or a professional approach. However I'm going to give you all the information I have, and let you decide.
What transpires with using the hot air gun method, is that the chipset is NOT heated to the proper temperature, nor length of time.
Using that method, you need a specialized temperature probe, and constantly check along the entire surface of the chipset, as you EVENLY heat the chipset. (Hot air gun is constantly moved around the chipset, so there is an even heat applied. It is also moved around at a slow rate)
Also again, there is the proper amount of time. Plus, the heat is withdrawn SLOWLY. A constant pattern is used, then the hot air gun is brought up so far, and the heat is still being applied evenly. The hot air gun is brought up even further away, while still evenly heating the chipset.
The method here, is to NOT let the chipset cool down too quickly. If it is cooled too quickly, the solder used in the solder joints, will not crystallize properly, and a poor solder joint will result. Hence why the specialized shops, with the specialized machines.
Take a look at an SMD/BGA Rework Station at work, and the info about Solder Balls, and the BGA surface mount technology,
Scroll down, click on the red - Take a few minutes to view the IR 650 demo video
OR, of course, replace the motherboard.
Another thing about the Compaq nc6000 series of Notebook PC's, is the cooling for the graphics chipset is inadequate. The surface area of the small metal plate, on the Cooling Tube; is too small in surface area.
This leads to overheating of the graphics chipset. Re-flowing the graphics chipset, AND adding more surface area, is the solution.
Only if you have knowledge on hardware Laptops you understand. The procedure go as follow: Unscrew the motherboard completely. Identify the North-Bridge BGA IC (BGA= ball grid arrays) under the mouse region. Get an SMD Rework Station. Suspend the board on a surface which cannot be affected by heat and held firmly whereby under the North-Bridge BGA IC is opened. Use your SMD Rework Station to generate heat evenly beneath the region North Bridge IC and press gently without being bridged. Mind you 90% risk is involve.