Question about HP ProBook 4530s Notebook
My HP4530s's battery discharges when it is switched off. It discharges at a rate about 1%~2% per day (switched off) But when the battery is removed from the laptop, battery never discharges itself. It seems like laptop uses battery even it's turned off. I have noticed that HP Power assistant keeps history data about laptop on,off time etc. Off time timer works only when battery is available. There is no option in bios or HP power manager related to disabling battery usage when laptop is turned off. Could anyone please help me to solve this problem?
Remove the battery when the laptop is OFF. I am not good at electronics, but I think this is normal and is NOT A PROBLEM.
Posted on Apr 17, 2013
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Posted on Jan 02, 2017
When you reinstall xp you will not have to reformat the drive. Just reinstall the operating system. As long as you are in safe mode back up what you need to then reinstall xp.
If you need more help let me know.
Posted on May 27, 2009
When the Caps Lock flashes, it is then being used in a diagnostic mode. 5 times flashing means a problem with the System Board.
I don't doubt it.
Two common problems, all based on one issue.
1) Problem One;
The Processor, and the GPU are the two hardware components that produce the most heat.
[ GPU = Graphics Processing Unit. Slang? Graphics chipset,
Chip and Chipset are slang terms for I.C.
It could be something as simple as foam has melted, and melted down onto the motherboard, near the Processor socket. Removal puts the laptop back into service again.
It could be much more complicated, and follow an issue that has beleaguered the HP Pavilion dv2000 series, dv6000 series, and dv9000 series.
The cooling system for the GPU is inefficient. Allows the GPU to overheat.
Constant overheating partially melts the solder connections of the GPU to the motherboard.
The graphics chipset (GPU) is mounted to the motherboard with a BGA surface mount.
Ball Grid Array,
To explain the BGA surface mount;
Compare to an older Intel Pentium 4 processor, and it's Socket 478 processor socket,
The processor has contact pins on the bottom. (478 of 'em) These line up with matching socket holes in the Socket 478 processor socket. (478)
With a BGA surface mount there are no contact pins, nor socket holes.
Solder Balls take the place of the contact pins, and Copper Pads take the place of the socket holes.
The graphics chipset's Solder Balls, are lined up with the matching Copper Pads on the motherboard.
Heat is then applied at a specific temperature, and length of time.
This procedure melts the Solder Balls, and solders the graphics chipset to the Copper Pads.
With constant overheating the solder connections that were created, start to melt. This creates a poor connection.
The professional method to repair this problem, is to use a BGA Rework Machine, to Properly re-solder the connections.
Due to the location of repair shops that have a BGA Rework Machine, and the C-O-S-T, many are attempting to perform the procedure with a non-professional method.
A thin metal shield is cutout in the middle, for the graphics chipset. This shield is set over the graphics chipset, and lays on the motherboard. Heat is then kept just to the graphics chipset, and the other components on the motherboard are protected.
Heat is applied with a propane torch, or a hot air gun, (Not hair dryer), in a circular (Spiral), pattern to the graphics chipset. With a more proper method used, the tip of a thermometer that can read this heat range, is laid on the chipset, and is used to keep the chipset at a specific temperature.
(Too much heat will burn up the chipset. Too little will not properly remelt the solder connections. A Cold Solder joint, or joints, will result)
The heat from the heating instrument, (Propane Torch/Hot Air Gun), is rotated around in a spiral pattern on the chipset. Constant moving around to distribute the heat evenly.
(You do not want a 'hot spot')
When the specific heat range is met, the heating instrument is slowly moved away from the chipset.
Move up an inch or so, keep spiraling. Then move up another inch or so, and keep spiraling the heat source. Slowly move up in increments while spiraling. S-L-O-W-L-Y back away. Method is used so that the chipset slowly cools down. Otherwise a cold solder joint, or joints, could result.
(Right back to where you started)
This link is to a video that shows one style of the procedure. It is not an advertisement for the video, just linked for the procedure information,
For additional questions please post in a Comment.
Posted on Nov 12, 2011
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