Question about SuperMicro X7DAE Motherboard
I have a supermicro processor x7dae with a row 0 channel 1 memory fault on bank 3. can you tell me the board location of the dimm to be repalced.ie 1a,1b,2a,2b...etc.
Remember to replace the DIMMs in pairs unless you have an exact duplicate spare.
Posted on Jul 03, 2015
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Posted on Jan 02, 2017
the broblem is probably your keyboard, since del doesn't work then this indicates that your keyboard could have some wires cut from inside the wire casing due to various reasons or the keyboard plug isn't well attached to the wires or have some bent pins.
my advice : go buy a new keyboard.
Posted on Dec 22, 2007
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Dual-channel architecture requires a dual-channel-capable motherboard and two or more DDR, DDR2 SDRAM, or DDR3 SDRAM memory modules. The memory modules are installed into matching banks, which are usually color coded on the motherboard. These separate channels allow each memory module access to the memory controller, increasing throughput bandwidth. It is not required that identical modules be used, but this is often recommended for best dual-channel operation. It is possible to use a single-sided module of 512 MB and a double-sided module of 512 MB in dual-channel configuration, but how fast and stable it is depends on the memory controller.
If the motherboard has two pairs of differently colored DIMM sockets (the colors indicate which bank they belong to, bank 0 or bank 1), then one can place a matched pair of memory modules in bank 0, but a different-capacity pair of modules in bank 1, as long as they are of the same speed. Using this scheme, a pair of 1 GB memory modules in bank 0 and a pair of matched 512 MB modules in bank 1 would be acceptable for dual-channel operation.
Modules rated at different speeds can be run in dual-channel mode, although the motherboard will then run all memory modules at the speed of the slowest module. Some motherboards, however, have compatibility issues with certain brands or models of memory when attempting to use them in dual-channel mode. For this reason, it is generally advised to use identical pairs of memory modules, which is why most memory manufacturers now sell "kits" of matched-pair DIMMs. Several motherboard manufacturers only support configurations where a "matched pair" of modules are used. A matching pair needs to match in.
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Dec 06, 2010 | Acer Aspire M5100 AM5100-U5313A AMD...
This motherboard can support up to 2Gb of DDR266 RAM modules.
Attached is part of the memory detail from the manual.
If you need a copy of the manual. please click on this link to download :-
188.8.131.52 Memory Configuration
Memory interface between the MCH and DIMMs is 144 bits wide. This requires that two DIMMs
be populated per bank in order for the system to operate. At least one bank has to be populated
in order for the system to boot. If additional banks have less than two DIMMs, the memory for
that bank(s) will not be available to the system.
There are two banks of DIMMs, labeled Bank1 and Bank2. Bank1 contains DIMM locations
DIMM1A and DIMM1B and Bank2 contains DIMM2A and DIMM2B. DIMM socket identifiers are
marked with silk screen next to each DIMM socket on the baseboard. The sockets associated
with any given bank are located next to each other.
The baseboard's signal integrity is optimized when memory banks are populated in order.
Therefore, DIMM Bank1 must be populated before Bank2.
DIMM and memory configurations must adhere to the following:
• DDR266 DDR registered DIMM modules
• DIMM organization: x72 ECC
• Pin count: 184
• DIMM capacity: 128 MB, 256 MB, 512 MB, 1 GB, 2 GB
• Serial PD: JEDEC Rev 2.0
• Voltage options: 2.5 V (VDD/VDDQ)
• Interface: SSTL2
• Two DIMMs must be populated in a bank for a 144-bit wide memory data path
• One or two memory banks may be populated
Table 2. Memory Bank Labels
Memory DIMM Bank Row
J8D22 (DIMM 1A), J8D15 (DIMM 1B) 1 0, 1
J8D7 (DIMM 2A), J8D1 (DIMM 2B) 2 2, 3
Note: Memory must be installed in pairs; DIMM Bank1 must be populated before DIMM Bank2.
Memory within a DIMM bank must be identical; between banks only the DIMM size may be
Functional Architecture Intel® Server Board SE7501BR2 Technical Product Specification
26 Revision 1.2
Intel Order Number C13977-003
Figure 3. Memory Bank Label Definition
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